Report, Telecom News, ET Telecom

Taipei: Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest chip subcontractor, is in talks with the German government over the possibility of establishing a factory in the European country.

According to Lora Ho, senior vice president of sales for Europe and Asia at TSMC, various factors such as government subsidies, customer demand and the talent pool would influence his final decision, reports The Taipei Times.

In June, TSMC chairman Mark Liu told shareholders the chipmaker had started evaluations on setting up manufacturing operations in the European country.

TSMC is developing new capabilities around the world, including a $ 7 billion semiconductor plant in Japan, as well as a $ 12 billion plant in Arizona that is expected to start mass production early in the year. 2024.

Meanwhile, TSMC has started pilot production of 3-nanometer chips and plans to produce them in volume by the end of 2022.

TSMC has started pilot production of chips built using N3 (i.e. 3nm process technology) at its Fab 18 in southern Taiwan.

Currently, Apple uses TSMC’s 5nm processors for M1 chips and it is expected that TSMC’s 3nm processors will power the next generation of Apple Silicon.

Compared to the 5nm process, the 3nm gate-all-around (GAA) node improves performance by 30%, reduces power consumption by 50%, and takes up 35% less space.

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